


| FEATURE | LHDPCB SPECIFICATION |
| Number of layers | 1 - 6L |
| Technology highlights | Mainly polyimide materials with all kinds stiffeners, FLEX PCB’s are necessary when motion of the PCB is needed, and it have more application for 5G products. |
| Materials | Polyimide, Polyester |
| Profile method | Laser cutting, punching, rout |
| Copper weights (finished) | 18μm - 70μm |
| Minimum track and gap | 0.075 mm / 0.075 mm,0.065 mm/0.065 mm for prototype |
| PCB thickness | 0.05 mm - 0.80 mm |
| Maxmimum dimensions | 450 mm x 610 mm, 220 mm*2200 mm for double layer prototype |
| Surface finishes available | OSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.1 mm |