Product Name: Hot Products Fr4 Copper Clad Lamiante Sheet for PCB Circuit Model NO.: fr4 Brand: Hjh Insulation Materials: metal Composite Materials base Material: Copper Production Process: Laminateing Processing Technology: Delay Pressure Foil Flame Retardant Properties: V0 Application: Consumer Electronics Material: Fiber Galss/Epoxy/Copper Foil Dielectric: FR-4 Structure: Single-Sided Rigid PCB Trademark: HJH Transport Package: Pallet Specification: Metri ton Origin: China HS Code: 7410211000 Product Description 1.FEATURES--Tg135±5ºC(DSC) --Halogen-free, Br/Cl content below 900ppm --UV Blocking/ AOI Compatible --Antimony-free --Conform to claim of RoHS --IPC-4101B specification is applicable2.APPLICATIONComputer,Mobile phone, Electronics Instrumentations Communication equipments etc. 3.TECHNICAL DATA SHEETTest ItemsUnitTest ConditionTest MethodIPC-TM-650SpecificationTypical ValueTgºCDSC2.4.25≥130135Peel strength 1ozN/mm288ºC, 10s2.4.8≥1.051.45FlammabilityRatingC-48/23/50UL94V-0V-0E-24/125Surface ResistivityMΩC-96/35/902.5.17.11042.0x106Volume ResistivityMΩ-cmC-96/35/902.5.17.11065.0x108Arc ResistanceSD-48/50+D-0.5/232.5.160124Dielectric BreakdownKVD-48/50+D-0.5/232.5.64056Dielectric Constant (1MHz)_C-24/23/502.5.5.2<5.44.7Dissipation Factor (1Mhz)_C-24/23/502.5.5.9<0.0350.016ThermalStressUnetchedSec288ºC, solder dip2.4.13.1≥30PassEtchedFlexural StrengthLWMPaA2.4.4415565CW345430Water absorption%D-24/232.6.2.10.350.21CTEZ-axisBefore Tgμm/mºCTMA2.4.24≤6050After Tgμm/mºCTMA≤30028050~260ºC%TMA≤3.02.9TdºC10ºC/min, N2,5% Wt Loss2.4.24.6≥340340T260MinTMA2.4.24.1-15T288MinTMA2.4.24.1-2