Product Name: Premium SD Card Reader Connector to Emmc BGA153 with Solder Ball Model NO.: 702-0000847 Contact: Pogo-Pin OEM: Acceptable Pitch Size: 1.0mm IC Size: 11.5X13mm Trademark: Sireda Transport Package: Carton Specification: BGA153 Origin: Shenzhen, China HS Code: 8536690000 Product Description SD solution, eMMC BGA153 test adapter to SD Card /SD Adapter with solder ballApplications-- Test, debug, vakidation and programming of eMMC and eMCP devices-- System and wafer test-- Failure analysis-- Package and chip qualification-- Production prototypeFeatures-- Suitable for eMMC and eMCP devices of Samsung, Hynix, Sandisk, Toshiba, Intel, Kinston, etc.-- Suppor for various eMMC versions-- Support hot plug, eMMC can be directly connected to PC with SD card reader-- Realize reading, accessing and writing data for eMMC and eMCP devices-- Socket clamp with rolling design makes it easy operation, less abration, so as to longer life spanSpecificationsMechanicalSocket BodyPPS/TorlonSocket LidAlContactpogo-pinContinous Operating Temperature-40ºC to 140ºCLife Span at Operating Travel100 Cycles Min.Spring Force27g/0.65mm per pinElectricalCurrent Rating(Continuous)2.59ASelf Inductiance1.57nHBandwidth @-1dB10GHzDC Resistance42mohm/0.65mmIf you would like to know more about us, please have a look at our website:www.sireda.com.