Product Name: Plastic Silicon Fast Recovery Diodes Model NO.: 1N5817, 1N5819.1N5822. SBR360, 21D-06 Signal Processing: Analog Digital Composite and Function Package: Do-15,R-1,a-405,Do-201ad,to-220ab Type: P-type Semiconductor Material: Compound Semiconductor Manufacturing Technology: Optoelectronic Semiconductor Trademark: ZG Brand Transport Package: by Sea, Packaging Specification: silicon, brass Origin: Auhui Province, China HS Code: 8541100000 Product Description Silicon powder coating is a kind of fast recovery diode switch characteristics, semiconductor diode reverse recovery time characteristics, mainly used in switching power supply, electronic circuits, such as the pulse width modulator, frequency converter, as a high frequency damping diode rectifier diode, the fly-wheel diode or use.Choose appropriate silicone sealants fast recovery diode characteristics, especially the reverse recovery characteristics, such as reverse recovery time and reverse recovery softness, can significantly reduce the switching devices, diodes, and many other circuit components in power loss.Silicone sealants fast recovery diodes, ontology, has two diode includes pins and encapsulation shell, described two diodes in encapsulation shell of ontology, including a p-n junction diode ontology, a positive terminal and a negative terminal, two diode connected to the negative terminal of the ontology, ontology in two diode negative terminals of the join point welding with a pin, two diodes, the positive terminal of the ontology and the welding with a pin, described in the pin is located in the packages, encapsulation shell coated with a layer of ontology can clearly show the diode parameters of uv curing ink layer.Considering the simple assembly, described packages for cuboid structure.Further, in order to beautiful, cost savings, on the encapsulation shell of the described process hole is set up.Beneficial effects of this utility model is the utility model has simple structure, diode ontology in encapsulation shell to ensure the electric property is not affected, encapsulation shell coated with a layer of working parameters of the coating can clearly show the diode ontology, in replacement of silica laminate and fast recovery diodes, won't appear mistake will work parameters do not meet the requirement of pipe change, avoiding the damage of silicone sealants fast recovery diode breakdown. chip size455MILAWG0.75*58inverse voltage≥1100Vswitch time≤250forward voltage drop≤1.3