Product Name: Mobile Phone Test Fixture_Emmc/Emcp/DDR/Flash, etc. Model NO.: Socket Phone Contact: Pogo-Pin Pitch: 0.35mm to 1.27mm Trademark: Sireda Transport Package: Carton Specification: Phone Test Fixture Origin: Shenzhen HS Code: 8536690000 Product Description "U" SolutionTest, debug and validation of devices of BGA, LGA, QFP, QFN, SOP, etcPitch from 0.35mm to 1.27mmFeatures- "U" solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc.-Patented Interposer design avoid problem of pad co-planarity, oxidation and damage of PC board after de- soldering comparing to conventional design.-Automatic current overload protection board avoid phone from burning.-Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy of maintenance and reduced testing downtime.-For customized or other types please contact Sireda Technology.How it works-Solder U interposer to PCB board.-Attach socket using four supplierd screws.-Lock bottom plate to top mask.-Insert device and lock lid, screw down heat sink actuator for device engagement.