PCB Manufacturing Capabilities: |
Layers |
1-20 Layers |
Laminate |
FR4, H-TG, CEM, Aluminum, Copper base, Rogers, |
Ceramics, Iron base |
Max. Board Size |
1200*480mm |
Min.Board Thickness |
2-Layer 0.15mm |
4-Layer 0.4mm |
6-Layer 0.6mm |
8-Layer 1.5mm |
10-Layer 1.6-2.0mm |
Min. Line Width/Trace |
0.1mm(4mil) |
Max. Copper Thickness |
10 OZ |
Min. S/M Pitch |
0.1mm(4mil) |
Max. S/M Pitch |
0.2mm(8mil) |
Min. Hole Dia. |
0.2mm(8mil) |
Hole Dia. Tolerance(PTH) |
±0.05mm(2mil) |
Hole Dia. Tolerance(NPTH) |
±0.05mm(2mil) |
Hole Position Deviation |
±0.05mm(2mil) |
Outline Tolerance |
±0.1mm(4mil) |
Twist/Bent |
0.75% |
Insulation Resistance |
>1012Ω Normal |
Electric Strength |
>1.3kv/mm |
S/M Abrasion |
>6H |
Thermal Stress |
288ºC 10Sec |
Test Voltage |
50-300V |
Min. Blind/Buried Via |
0.15mm(6mil) |
Surface Treatment |
OSP,HASL,LF-HASL,ENIG,Gold/Au Plating,Immersion Ag/Silver, |
Ag/Silver Plating,Immersion Tin,Tin Plating |
Testing |
E-test, Fly probe test |