Product Name: FR-1 Phenolic Paper Copper Clad Laminate Model NO.: FR-1 Brand: Hfi Material: Paper Phenolic Copper Foil Substrate Mechanical Rigid: Rigid Application: Consumer Electronics Processing Technology: Delay Pressure Foil Insulation Materials: Epoxy Resin base Material: Copper Dielectric: FR-1 Flame Retardant Properties: HB Type: Rigid Circuit Board Trademark: HFI Transport Package: Pallet Specification: IEC Origin: China HS Code: 74102100 Product Description FR-1 Phenolic Paper Copper Clad LaminateDescription :3. Phenolic Paper, Flame Resistance Copper Clad Laminate is made of phenolic paper as the reinforcement adhere by flame resistance epoxy resin. With good electrical and mechanical characters, heat resistance and smooth appearance, it is suitable for products with high request electron insulating, such as electrical insulating seat and plate for related appliance and instruments.2. Usual thickness ranges from 0.5mm to 2.0mmUsual sizes include: 20''x 24''; 30''x 36''; 40''x 48''; 41''x 49'', 43'' x 49''Copper clading: H/0; H/H; 1/0; 1/1; 2/0; 2/2UL Certificate: YesGrade: IPC AOther specification upon requests.3. Purchasing InformationTypeThicknessCopper CladdingUsual SizeCTI ValueFR-10.8mm ~ 1.60mm18/0035/0070/0040" x 40"40" x 48"175/600VProduct show :