Product Name: Aluminum-based Copper-Clad Laminate (AL CCL) Model NO.: AF & MF Brand: Hfi Insulation Materials: metal Composite Materials base Material: Aluminum Production Process: Subtractive Process Processing Technology: Delay Pressure Foil Flame Retardant Properties: HB Application: Consumer Electronics Material: Aluminum-based+Epoxy Fiberglass Fabric Dielectric: Aluminum-based Structure: Multilayer Rigid PCB Trademark: HFI Transport Package: Standard Package Specification: IPC4101, UL Origin: China HS Code: 74102110 Product Description Al Copper Clad LaminatesThis kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.1. Usual size: 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm --excellent heating radiating --good electric magnetic shield --good electrical and machinery cutting2. AL: 1100, 1060, 3003, 5052Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm. 1.5mm, 1.6mm. 2.0mm. 3.0mm3. Copper thickness: Hoz, 1oz, 2oz, 4oz, 6oz, 25μ MSize: 500*600mm, 500*1200mm, 1000*1200mmThermal conductivity: 0.8W/m. K 1.0W/m. K, 1.5W/m. K, 1.8W/m. K, 2.0W/m. K, 3.00W/m. KProtective film: Normal temperature, medium temperature, High temperature4.Applications:Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV,LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.5.Purchasing InformationUsual SizethicknessCopper CladdingDielectric layerThermal conductivity500*600mm500*1200mm1000*1200mm0.6mm0.8mm1.0mm1.2mm1.5mm2.0mm3.0mmHOZ1OZ2OZ3OZ4OZ6OZ25μm75μm100μm120μm125μm150μm200μm0.8W/m.K1.0W/m.K1.5W/m.K1.8W/m.K2.0W/m.K3.00W/m.K