Product Name: 0.2mm 0.3mm 0.4mmt Corning Eagle Xg Glass Wafer for Mircroelectronic System Model NO.: tk21 Flatness: 1nm Surface Quality: 40/60 Roghness: 1nm Temperature: 550dergee C Polsihing: Both Sides Trademark: TKING Transport Package: 1PCS Sperate Pack+ Carbon Case+ Plywood Case Specification: Big size: 40*23*22cm Small size: 31*19*18cm Origin: Made in China HS Code: 7001000090 Product Description lGlass wafer: The company introduces advanced laser equipment, ultrasonic instruments, engraving and grinding machines and other advanced equipment, and has experienced technicians who can provide customers with high-precision glass wafers with thickness≥0.1mm and external dimensions ≥Φ2" Glass wafer), used in CMOS, CCD sensors, integrated circuits or micro-mechanical component packaging (MEMS), communications and data processing, optics, electronics, home appliances, military, scientific research and other high-tech products.lProductfeatures:a)Application-specificuseofglassmaterialb)Vastexpertiseintheareaofpolishinganduniquesurfacequalitiesc)Cleanroomcompatiblepackagingofready-to-usesubstratesd)Structuredwaferswithexcellenttolerancese)Customer-specificproductsthatmeetallrequirementsandindustrystandards(e.g.SEMI)f)IntegratedproductionprocessesthatmeetISO9001:2000requirementsandstandardslTypical application:Micro-opticsMEMS (pressure sensor, accelerometer...)Wafer level packaging (image sensor package...)Bioengineering (microfluidics, DNA analysis...)PLC wafer coverAnd many other customer-specific applications.lTechnologyparameters:a) Material:BOROFLOAT®33,PYREX7740,Quartzglass,b) Thickness:0.3mm,0.5mm,0.6mm,0.7mm,1.0mm,1.5mm(Tolerance±0.02mm)c) Roundize:Φ2",Φ3",Φ4",Φ5",Φ6",Φ8",Φ12"ect..d) MIL:60/40e) Roughness(Ra)Less1.5nmf) TTVLess0.01mmg) ChamferC0.05~0.2mmh) EdgecollapseLess0.2mmGlass wafer plus technical parameter:a) Material: BOROFLOAT®33, PYREX7740, quartz glass, Corning E-XG, B270, D262T, AF32b) Standard thickness: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)c) Standard size: Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)d) Appearance: 60/40e) Surface roughness (Ra) <1.5nmf) Parallelism <0.01mmg) Each edge is blunt C0.05~0.2mmh) Crack <0.2mm, not crackablei) The surface is clean and must not be imprinted or stained. It is packaged under a clean workbench and packaged in a special box.Basic performance of glass wafers:Technical parameters: density (25 ° C) 2.23g / cm2Expansion coefficient (ISO 7991) 3.25'10-6k-1Light transmittance 91%Softening point 820 ° CShort-term use <10h 550 °CLong-term use≥10h 450°CRefractive index (587.6nm) 1.47140Knoop hardness 480