Product Name: High Thermal metal Core Aluminium PCB Model NO.: Aluminium PCB-6 Condition: New Customized: Customized Certification: RoHS, CCC, ISO, SGS base Material: Aluminium Layers: Single-Layer metal Coating: Copper Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K Ccl Brand: Jh,Ccaf.etc Sample Date: 3-5days Trademark: ZAPON Transport Package: Vacuum Packing Specification: UL ISO TS16949 IPC Origin: China HS Code: 85340090 Product Description Product Description:Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.Note: We specially produces metal base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.Thickness of the copper: 18um, 35um, 70um, 105um.base size: 500mm ×, 600mm (20"×, 24"); 600mm ×, 1060mm (24"×, 42")CCAF-01 Aluminum-base copper-clad laminateThe test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminateThickness of the copper: 35umThickness of the diclectric: 70umThickness of the aluminum-base: 1.5mmTechnique parameter:Test itemTechnology requestUnitTest result1Peel StrengthA≥ 1.8N/mm2After thermal stress (260ordm;C)≥ 1.8N/mm1.82Blister test AfterThermal stress (260ºC, 2min )No delaminating/Ok3Flammability(A)FV-O/FV-O4Thermal resistance≤ 2.0ordm;C/W15Surface ResistivityA≥ 1 × 10 5M Ω5 × 10 7Constant humidity treatment≥ 1 × 10 5M Ω2 × 10 6(90%,3 5 ordm;C,96h)6Volume ResistivityA≥ 1 × 10 6M Ω· m4 × 10 8Constant humidity treatment≥ 1 × 10 6M Ω· m5 × 10 7(90%,3 5ordm;C ,96h)7Dielectric Breakdown ( DC )≥ 28.5Kv/mm318Dielectric constant (1MHz )≤ 4.4/4.2(40 ordm;C,93%, 96h )9Dielectric dissipation factor (1MHz )≤ 0.03/0.02(40 ordm;C, 93% ,96h )